
| Parameter | Specification Details |
| Material Name | Titanium Aluminum Sputtering Target Scrap (TiAl 50/50 - 2N7) |
| Cleanliness Grade | Clean (Free of backing plates, bonding solder, heavy oxidation, oil, and tramp iron) |
| Purity Grade | 2N7 (Minimum 99.7% metallic purity relative to total metallic elements) |
| Titanium Content (Ti) | Range 48% to 52% (Atomic / Weight Ratio ~50:50 Nominal) |
| Aluminum Content (Al) | Range 48% to 52% (Atomic / Weight Ratio ~50:50 Nominal) |
| Trace Impurities | Fe, C, O, N, H, Si (Combined less than 0.3%) |
| Physical Form | Spent Sputtering Targets, Planar Tiles, Rotary Target Segments, Machining Offcuts |
| Density | 3.7 to 3.9 g/cm3 |
| Melting Point | Approximately 1460 C to 1500 C |
Backing Plate Removal: Spent sputtering targets must be completely de-bonded from copper, elastomer, or indium backing plates to achieve full clean target scrap valuation.
Solder & Contamination Limits: Zero tolerance for residual Indium (In) solder, elastomer bonding agents, or heavy ceramic oxide layers on the target surface.
Recycling Stream: High-purity 2N7 TiAl targets are recycled into specialized master alloy production or high-grade titanium-aluminum additive manufacturing inputs.
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